Introduction
Relevant

TO HEADERS AND CAPS


Transistor Outline package (more commonly referred to as TO packages) is the most common package for microelectronic packaging housing. A TO package always consists of two components: a TO header and a TO cap. While the TO header makes sure that the encapsulated components are provided with power, the cap ensures the smooth transmission of optical signals. This includes the transmitters (e.g. laser diodes) as well as the receivers of the optical signals (e.g. photodiodes).

The TO header provides a mechanical basis for the installation of electronic and optical components.such as semiconductors, laser diodes or simple electronic circuits, while at the same time providing power to the encapsulated components with the aid of pins. Optical components in TO packages such as photodiodes and laser diodes are particularly susceptible to damage from their environment. Humidity, in particular, can cause semiconductor elements to corrode rapidly, leading to failure of the entire component. This is why these TO header components require reliable and permanent protection.

Kiegoo can supply TO3, TO5, TO8, TO39, TO46, TO56 etc headers and caps

Material: Kovar, CRS, copper
Plating: Electroless Nickel, Au
Glass-to-metal seal
Cap with window, N-BK7 or sapphire

TO46 Header


TO56 Header


TO CAN

TO3 Header


TO56 Cap


 

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