Hermetic Hybrid IC Packages
Hermetic Hybrid Integrated Circuits Packages
Kiegoo provides glass-to-metal seal hermetic package housing for hybrid integrated circuits with high reliability. It's suitable for power modules, sensors, multi-chip module, power amplifier, wave-filters, pulse width modulators, converters and other components. It's applied to defense, aerospace, medical, microwave electronics etc.
hermetically sealed packages for power hybrid circuits, IC chips, hermetic sealing hybrid IC
Material: KOVAR, Cold Rolled Steel, Oxygen-free Copper, Tungsten Copper, AlSiC
Current: 100A Max
Voltage: DC 3000V Max
Surface Treatment: Plating Ni, Au
Insulation Resistors: ≥1×1010Ω at 500V DC
Salt Spray Proof: 24h at least
DIL/DIP Package, Flatpack, Platform packages and other customized hybrid packages are available.