Hermetic Hybrid Integrated Circuits Packages

Kiegoo provides glass-to-metal seal hermetic package housing for hybrid integrated circuits with high reliability. It's suitable for power modules, sensors, multi-chip module, power amplifier, wave-filters, pulse width modulators, converters and other components. It's applied to defense, aerospace, medical, microwave electronics etc.



hermetically sealed packages for power hybrid circuits, IC chips, hermetic sealing hybrid IC
Material: KOVAR, Cold Rolled Steel, Oxygen-free Copper, Tungsten Copper, AlSiC

Current: 100A Max

Voltage: DC 3000V Max

Surface Treatment: Plating Ni, Au

Hermeticity: ≤1×10^-3Pa.cm³/s(He)

Insulation Resistors: ≥1×10¹⁰Ω  at 500V DC

Standard: MIL-STD-883

Salt Spray Proof: 24h at least



DIL/DIP Package, Flatpack, Platform packages and other customized hybrid packages are available.