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Microwave Package
Hermetic Packages for RF & Microwave Components
Kiegoo provides various hermetic packages with high frequency pins and connector for RF and microwave devices with low thermal resistance heat sink materials. It's suitable for coaxial transmitter and receiver subassembly, RF & Microwave power modules etc.
Generally, microwave components are a low power device, and the main material for microwave packages is Kovar. But if it's a high power amplifier, we can also manufacture the Tungsten-Copper/WCu alloy brazed as a baseplate to dispatch heat so that the whole device can have a more stable performance.
Working Frequency: DC to 40GHZ
VSWR: <1.25
Ampedance: 50 Ohm
Material: Kovar, Aluminum, Stainless Steel, Cold Rolled Steel, Oxygen-free Copper, Tungsten Copper, AlSiC
Surface Treatment: Electroless or Electrolytic Ni, and Au plated
Plating Performance: No blisters on Au(in air) at 400° for 3min at least
Hermeticity: ≤1×10-3Pa.cm3/s(He)
Insulation Resistors: ≥1×1010Ω at 500V DC
Standard: MIL-STD-883
Kiegoo provides various hermetic packages with high frequency pins and connector for RF and microwave devices with low thermal resistance heat sink materials. It's suitable for coaxial transmitter and receiver subassembly, RF & Microwave power modules etc.
Generally, microwave components are a low power device, and the main material for microwave packages is Kovar. But if it's a high power amplifier, we can also manufacture the Tungsten-Copper/WCu alloy brazed as a baseplate to dispatch heat so that the whole device can have a more stable performance.
Working Frequency: DC to 40GHZ
VSWR: <1.25
Ampedance: 50 Ohm
Material: Kovar, Aluminum, Stainless Steel, Cold Rolled Steel, Oxygen-free Copper, Tungsten Copper, AlSiC
Surface Treatment: Electroless or Electrolytic Ni, and Au plated
Plating Performance: No blisters on Au(in air) at 400° for 3min at least
Hermeticity: ≤1×10-3Pa.cm3/s(He)
Insulation Resistors: ≥1×1010Ω at 500V DC
Standard: MIL-STD-883
