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Glass-to-Metal Seals
14 Pins Glass to metal hermetically sealed butterfly package
Glass to metal seals technic means sintering the glass with metal and forming a electrical connector feedthrough the metal wall of hermetically sealed packages. Generally, the material of frame/wall is Kovar which has a similar thermal expansion coefficients with sealing borosilicate glass to have a good match for heat dissipation in hermetic butterfly packages.
Package Materials:
| Base Material | W85CU15 / Kovar |
| Frame | Kovar |
| Pipe | Kovar |
| Lead | Kovar |
| Hermetic sealing | Glass-to-Metal |
| Brazing | Ag/Cu alloy |
Technical Parameters:
Hermeticity: ≤1×10-3Pa.cm3/s(He)
Insulation Resistance: ≥1×1010Ω at 100V DC
Plating: Electroless or Electrolytic Ni >2.5μm, Electrolytic Au>1.3μm
Plating Quality: No blisters on Au after 3 min(in air) at 400℃
Standard: MIL-STD-883, Telecordia
Plating: Electroless or Electrolytic Ni >2.5μm, Electrolytic Au>1.3μm
Plating Quality: No blisters on Au after 3 min(in air) at 400℃
Standard: MIL-STD-883, Telecordia
RF connector and optical window for hermetic packages available
Applications:
suitable for packaging Pump Diode Laser Module, Photodiode, Fiber Optic Module, Telecommunication, Semiconductor Optical Amplifier, SOA module, Opto-electronic components, microelectronic components etc.
