• butterfly package
  • Butterfly Package Model:FOF


Microelectronic and Optoelectronic Package Solution

Hermetic packages are used for opto-electronic components and micro electro-mechanical systems(MEMS) to protect the internal components from potentially corrosive or otherwise damaging elements such as water vapor and oxygen.

Nowdays, microelectronics and optoelectronics have became the most important application field in our life. The assembly and packaging is key element to whole product development. We would be pleased to serve you with various kinds of package housing.

photonic package

Hermeticity: ≤1×10-3Pa.cm3/s(He)
Insulation Resistance: ≥1×1010Ω  at 100V DC
Thickness of Ni /Au plated: 2.5μm /1.3μm
Plating Quality: No blisters on Au after 3 min(in air) at 400℃
Window: Sapphire, AR coated on both side
Standard: MIL-STD-883, Telecordia

hermetic seal butterfly package


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