Ceramic to Metal |14 Pins Butterfly Package | Products

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Ceramic-to-Metal Seals

14-pins butterfly package Model：FOFC2113-14
14-pins ceramic to metal sealing butterfly package housing
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Introduction

Relevant

14 Pins Ceramic to metal hermetically sealed butterfly package

Multilayer HTCC ceramic package

14-pins butterfly package

PERFORMANCE PARAMETERS:

Hermeticity: ≤1×10^-3Pa.cm³/s(He)

Insulation Resistance: ≥1×10¹⁰Ω at 100V DC
Lead Resistance: ≤30 mΩ
Lead Pull Strength: 1.5N min pulled 90º to plane of ceramic
Lead Fatigue: pass 45º arcs with 225g weight

Thickness of Ni /Au plated: 2.5μm /1.3μm
Plating Quality: No blisters on Au after 3 min(in air) at 400℃
Standard: MIL-STD-883, Telecordia

MATERIALS

1. CU-W BASE(WCU10/WCU15)

2. KOVAR FRAME

3. BLACK CERAMIC FEEDTHROUGH AL₂O₃

4. KOVAR/ALLOY42 LEAD

5. KOVAR SEAL RING

6. KOVAR PIPE

Featured as high hermiticity and reliability, ceramic feed-through 14-pins butterfly ceramic package is suitable for DFB laser, DBR laser module, high power Butterfly Packed Module, SOA, Pump Laser Diode Module, Tunable Laser, Photodiode, Telecommunication, Fiber Optics Components etc. It has better performance and is more reliable than glass to metal sealed package.

Ceramic sheets are drilled vias and laminated, multilayer ceramic is co-fired at 1600℃ to finish the metallization, then the hermetic ceramic feedthrough was brazed on the metal housing.

Semiconductor optical amplifier SOA package

Hermetically sealed packaging lid with parallel seam seal and laser welding are both available.

Other type package housing can be customized, please send us the drawings for further discussion.