14-pins butterfly package
14-pins ceramic to metal sealing butterfly package housing
14 Pins Ceramic to metal hermetically sealed butterfly package
Multilayer HTCC ceramic packagePERFORMANCE PARAMETERS:Hermeticity: ≤1×10-3Pa.cm3/s(He)Insulation Resistance: ≥1×1010Ω at 100V DC
Lead Resistance: ≤30 mΩ
Lead Pull Strength: 1.5N min pulled 90º to plane of ceramic
Lead Fatigue: pass 45º arcs with 225g weightThickness of Ni /Au plated: 2.5μm /1.3μm
Plating Quality: No blisters on Au after 3 min(in air) at 400℃
Standard: MIL-STD-883, TelecordiaMATERIALS1. CU-W BASE(WCU10/WCU15)2. KOVAR FRAME3. BLACK CERAMIC FEEDTHROUGH AL2O34. KOVAR/ALLOY42 LEAD5. KOVAR SEAL RING6. KOVAR PIPEFeatured as high hermiticity and reliability, ceramic feed-through 14-pins butterfly ceramic package is suitable for DFB laser, DBR laser module, high power Butterfly Packed Module, SOA, Pump Laser Diode Module, Tunable Laser, Photodiode, Telecommunication, Fiber Optics Components etc. It has better performance and is more reliable than glass to metal sealed package.
Ceramic sheets are drilled vias and laminated, multilayer ceramic is co-fired at 1600℃ to finish the metallization, then the hermetic ceramic feedthrough was brazed on the metal housing.Hermetically sealed packaging lid with parallel seam seal and laser welding are both available.Other type package housing can be customized, please send us the drawings for further discussion.